EBEAM EVAPORATOR ANGSTROM
4 pockets, 10kV Power
Substrate size – pieces to 6”
Materials: Ti, Al, Al2O3 Gas: Ar, 5% O2 in Ar
Variable angle stage with Substrate rotation
Substrate heater Ion Milling – substrate cleaning
Fully automated deposition tool with load lock.
EBEAM EVAPORATOR LESKER PVD 75
E-beam Evaporator 4 pockets, 5kV Power
Substrate size – pieces to 6” Substrate rotation
Standard source to substrate distance is approx. 15″ (381mm)
Materials: Ti, Au, Pt, Pd, Cr, Ni and Ag
EBEAM EVAPORATOR CHA MARK 40
10 kW Solid State Electron Beam Power
Supply with an EB Controller and Sweep Controller
Electron beam gun with 6 each, 15cc pockets. Includes an EB Gun deposition shield with motor-driven rotation and lift lid.
The Inficon IC/6 Rate and Thickness Deposition Controller 8kW Heater Array and PLC Heater Power Supply Computer Control;
PLC Automation Lift-off Fixturing, rotating dome for 22 each, 100mm back loaded substrates.
ALD VEECO SAVANNAH S200
Sample size pieces up to 200 mm2
Operational Modes: Continuous Mode,
Exposure Mode (ultra-high aspect ratio) Deposition
Uniformity: (Al2O3) <1% (1s) Precursor- Pt, Ru Ozone Generator
SPUTTERING LESKER PVD 75
Magnetron Sputtering
5 targets 4DC/1RF DC
Power – 500 Watts
RF Power – 300 Watts
Sample Size – 6” Target: 2”
Substrate rotates Process gas: Ar, O2
Materials: Au, Pt, Ti, Al, W, Mo, Cu, SiO2, Al2O3, ITO
PECVD OXFORD PRO 100
Gases – 2% SiH4/N2, NH3, N2O, N2, He, CF4
Wafer sizes Up to 6” wafer
Deposit materials: SiO2, Si3N4, SiNO. 240mm diameter electrode.
Heated aluminum electrode for temperatures up to 400°C.
Fixed height without wafer clamping.
300W RF generator 500W LR generator