Packaging

DICING SAW – DISCO DAD 3350

Capable of handling a maximum of 8-inch or 250 x 250 mm workpieces LCD touch screen and Graphical User Interface (GUI) 1.8 kW spindle 
X-axis Cutting range 260 mm 
Cutting speed mm/s 0.1 ~ 600
Y-axis Cutting range 260 mm
Index step: 0.0001 mm Z-axis 
Max. stroke: 32.2 mm
Moving resolution: 0.00005 mm
Repeatability accuracy: 0.001 mm                  

SOP – DISCO DICING SAW

DICING SAW TRAINING VIDEO – PART1

DICING SAW TRAINING VIDEO – PART2

DICING SAW TRAINING VIDEO – PART3


WAFER SCRIBE & BREAK – LATTICE AX 420

Lattice Ax 420 delivers our highest cleaving accuracy of 10-μm in <5 min making it ideal for the lab that values speed and high accuracy while at the same time needing to accommodate a variety of sample sizes, thicknesses and materials.

SOP – LATTICE SCRIBE


WEDGE & BALL BONDER – FS 53BDA

Manual & Semi-Auto operation Ball, Bump, Wedge, Ribbon Deep Access Wedge
Ultrasonic 67kHz, 2” spool
Programmable Single Bonds
Heated stage
Motorized Z & Y Axis
Wire size 17 um-75um
Wedge Bond – Aluminum
Wire Ball Bond – Gold Wire                        

SOP – WIRE BONDER

Manual – FS 53BDA