Magnetron Sputtering, 5 targets 4DC/1RF
DC Power – 500 Watts RF Power – 300 Watts
Sample Size – pieces to 6”
Target size : 2”
Substrate rotation
Process gas: Ar, O2
Materials: Au, Pt, Ti, Al, W, Mo, Cu, SiO2, Al2O3, ITO
SPUTTERING LESKER PVD 75
Magnetron Sputtering, 5 targets 4DC/1RF
DC Power – 500 Watts RF Power – 300 Watts
Sample Size – pieces to 6”
Target size : 2”
Substrate rotation
Process gas: Ar, O2
Materials: Au, Pt, Ti, Al, W, Mo, Cu, SiO2, Al2O3, ITO